Nitride-based semiconductor device

ABSTRACT

A nitride-based semiconductor device includes a diode provided on a semiconductor substrate. The diode contains a first nitride-based semiconductor layer made of non-doped Al X Ga 1-X N (0≦X&lt;1); a second nitride-based semiconductor layer made of non-doped or n-type Al Y Ga 1-Y N (0≦Y≦1, X&lt;Y) having a lattice constant smaller than that of the first nitride-based semiconductor layer; a first electrode formed on the second nitride-based semiconductor layer; a second electrode formed on the second nitride-based semiconductor layer; and an insulating film that covers the second nitride-based semiconductor layer below a peripheral portion of the first electrode. In the diode, a recess structure portion is formed at a position near the peripheral portion of the first electrode on the second nitride-based semiconductor layer, and the first electrode covers the second nitride-based semiconductor layer and at least a part of the insulating film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2005-380321, filed on Dec. 28,2005; the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a nitride-based semiconductordevice with a diode structure and a nitride-based semiconductor devicewith a diode and a field effect transistor provided on a same substrate.

2. Description of the Related Art

A power semiconductor device such as a switching device and a diode isused for a power conversion device such as a switching power supply. Ahigh breakdown voltage, a low on-voltage, and a low reverse-bias leakcurrent are demanded for the power semiconductor device. To obtain thehigh breakdown voltage, it is effective to use a material having highcritical electric field. From these facts, a nitride-based semiconductordevice made of a nitride-based semiconductor material is useful as asemiconductor device which is used in the power conversion device.

As a conventional nitride-based semiconductor device, a field effecttransistor structured in the following manner has been known. The fieldeffect transistor is such that a carrier traveling layer made ofAl_(X)Ga_(1-X)N (0≦X<1) film and a barrier layer made of Al_(Y)Ga_(1-Y)N(0<Y≦1, X<Y) film are successively laminated, and that a gate electrodeis formed at a predetermined position on the surface of the barrierlayer having a uniform thickness, and a source electrode and a drainelectrode are formed at positions nearly symmetric across the gateelectrode.

The AlN film has a lattice constant smaller than that of the GaN film.Therefore, when the Al composition ratio in the barrier layer is greaterthan the Al composition ratio in the carrier traveling layer, thelattice constant of the barrier layer becomes smaller as compared withthat of the carrier traveling layer, and a distortion occurs in thebarrier layer. In the nitride-based semiconductor, piezoelectric chargeis produced in the barrier layer due to the piezo effect caused by thedistortion in the barrier layer. The piezoelectric charge produced atthat time causes a two-dimensional electron gas to be formed at theinterface between the carrier traveling layer and the barrier layer.

For example, when the GaN film having the Al composition of X=0 is usedas the carrier traveling layer and the Al_(Y)Ga_(1-Y)N film is used asthe barrier layer, a carrier density n_(s) of the two-dimensionalelectron system to a film thickness d₁ of the barrier layer is obtainedfrom the following equation (1) (J. P. Ibbetson et al., “Polarizationeffects, surface states, and the source of electrons in AlGaN/GaNheterostructure field effect transistors”, Applied Physics Letters, Jul.10, 2000, Vol. 77, No. 2, P. 250-252).

n _(s)=σ_(PZ)×(1−T _(c) /d ₁) [cm⁻²]  (1)

Where σ_(PZ) is a charge density of piezoelectric charge produced in thebarrier layer, and d₁ is a thickness of the barrier layer below the gateelectrode. Further, Tc is a critical thickness of the barrier layer inwhich the carrier is generated. The critical thickness Tc is given bythe following equation (2), and shows a dependency to the Alcomposition.

T _(c)=16.4×(1−1.27×Y)/Y[Å]  (2)

As a device made of the nitride-based semiconductor material, a diode asfollows can be considered. The diode is such that the carrier travelinglayer made of a GaN film in which Al composition is X=0 and the barrierlayer made of Al_(Y)Ga_(1-Y)N (0≦Y≦1) film are successively laminated,and that an anode electrode having a Schottky contact and a cathodeelectrode having an ohmic contact which is arranged so as to surroundthe anode electrode are formed on the barrier layer with a predeterminedthickness.

When the anode electrode with the Schottky contact is produced usingmetal such as Ni or Pt on the barrier layer, a Schottky barrier heightis about 1 electron volt (eV). And then, a forward bias is applied tothe anode electrode, and the nitride-based semiconductor devicestructured as above is caused to perform diode operation. An on-statevoltage upon the diode operation becomes high such as about 1 volt (V),which is almost as high as the Schottky barrier height.

To lower the on-state voltage, the Schottky barrier height needs to bedecreased. To decrease the Schottky barrier height, a method ofreplacing the material of the anode electrode with a metal having a lowwork function can be considered, but in this case, a reverse-bias leakcurrent is increased. According to a calculation allowing for specificthermal emission, if the on-voltage is lowered by 0.1 V, thereverse-bias leak current increases by one digit or more. In otherwords, it is difficult for the nitride-based semiconductor device, whichincludes the anode electrode having the Schottky contact and the cathodeelectrode having the ohmic contact, to lower the on-voltage whilekeeping the reverse-bias leak current to be low.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a nitride-basedsemiconductor device comprising: a diode provided on a semiconductorsubstrate, the diode including a first nitride-based semiconductor layermade of non-doped Al_(X)Ga_(1-X)N (0≦X<1); a second nitride-basedsemiconductor layer formed on the first nitride-based semiconductorlayer and made of non-doped or n-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y)having a lattice constant smaller than that of the first nitride-basedsemiconductor layer; a first electrode formed on the secondnitride-based semiconductor layer; a second electrode formed on thesecond nitride-based semiconductor layer spaced from the first electrodeso as to surround the first electrode; and an insulating film thatcovers the second nitride-based semiconductor layer below a peripheralportion of the first electrode, wherein a recess structure portion isformed by removing a part of the second nitride-based semiconductorlayer at a position near the peripheral portion of the first electrodeon the second nitride-based semiconductor layer, and the first electrodeis formed so as to cover the second nitride-based semiconductor layersurrounded by the recess structure portion and at least a part of theinsulating film formed on the recess structure portion.

According to another aspect of the present invention, a nitride-basedsemiconductor device comprising: a diode provided on a semiconductorsubstrate, the diode including a first nitride-based semiconductor layermade of non-doped Al_(X)Ga_(1-X)N (0≦X<1); a second nitride-basedsemiconductor layer formed on the first nitride-based semiconductorlayer and made of non-doped or n-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y)having a lattice constant smaller than that of the first nitride-basedsemiconductor layer; a first semiconductor layer formed on the secondnitride-based semiconductor layer and made of a semiconductor having alattice constant equal to that of the first nitride-based semiconductorlayer; a second semiconductor layer formed on the first semiconductorlayer and made of a non-doped or n-type semiconductor having a latticeconstant smaller than that of the first nitride-based semiconductorlayer; a first electrode formed on the second semiconductor layers; asecond electrode formed spaced from the first electrode so as tosurround the first electrode, and formed on any one of the secondnitride-based semiconductor layer, the first semiconductor layer, andthe second semiconductor layer; and an insulating film that covers thefirst semiconductor layer below a peripheral portion of the firstelectrode, wherein a recess structure portion is formed at a positionnear the peripheral portion of the first electrode on the secondsemiconductor layer, a bottom of the recess structure portion beingreached to the first semiconductor layer, and the first electrode isformed so as to cover the first and second semiconductor layers whichare surrounded by the recess structure portion, and at least a part ofthe insulating film formed on the recess structure portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic plan view of a nitride-based semiconductor deviceaccording to a first embodiment;

FIG. 1B is a cross-sectional view taken along the line A-A of FIG. 1A;

FIG. 2 is a schematic view of an energy state of a conduction band atthe central portion of an anode electrode in FIG. 1A and FIG. 1B;

FIG. 3 is a graph of a relationship between the thickness of the barrierlayer and the carrier density in the nitride-based semiconductor device;

FIG. 4 is a schematic view of a case where reverse bias is applied tothe anode electrode of the nitride-based semiconductor device in FIG.1B;

FIG. 5 is a schematic view of the cross-sectional structure of aconventional nitride-based semiconductor device using a Schottkycontact;

FIG. 6 is a graph of a relationship between a critical thickness and adifference in a composition ratio between a carrier traveling layer andthe barrier layer;

FIG. 7A to FIG. 7G are schematic cross-sectional views of one example ofa procedure for a method of manufacturing the nitride-basedsemiconductor device according to the first embodiment;

FIG. 8 is a schematic view of a modification of the nitride-basedsemiconductor device according to the first embodiment;

FIG. 9 is a schematic view of another modification of the nitride-basedsemiconductor device according to the first embodiment;

FIG. 10 is a schematic view of another modification of the nitride-basedsemiconductor device according to the first embodiment;

FIG. 11 is a schematic view of another example of the nitride-basedsemiconductor device according to the first embodiment;

FIG. 12 is a schematic cross-sectional view of a nitride-basedsemiconductor device according to a second embodiment;

FIG. 13A is a schematic plan view of a nitride-based semiconductordevice according to a third embodiment;

FIG. 13B is a cross-sectional view taken along the line B-B of FIG. 13A;

FIG. 14A to FIG. 14I are schematic cross-sectional views of one exampleof a procedure for a method of manufacturing the nitride-basedsemiconductor device according to the third embodiment;

FIG. 15 is a schematic cross-sectional view of a nitride-basedsemiconductor device according to a fourth embodiment;

FIG. 16 is a schematic cross-sectional view of a nitride-basedsemiconductor device according to a fifth embodiment;

FIG. 17 is a schematic view of an energy state of a conduction band inthe depth direction at the position where the gate electrode of FIG. 16is formed; and

FIG. 18 is a schematic view of an energy state of a conduction band inthe depth direction at the position where the source electrode/the drainelectrode of FIG. 16 is formed.

DETAILED DESCRIPTION OF THE INVENTION

Exemplary embodiments of the present invention are explained in detailbelow with reference to the accompanying drawings. It is noted that thepresent invention is not limited by these embodiments. Further, thecross sections of the nitride-based semiconductor devices used in theembodiments are schematic, and therefore, a relation between thethickness and the width of each layer or a ratio between the thicknessesof the layers is different from its real one.

FIG. 1A is a schematic plan view of a nitride-based semiconductor deviceaccording to a first embodiment, and FIG. 1B is a cross-section takenalong the line A-A of FIG. 1A. The nitride-based semiconductor device isobtained by successively laminating a carrier traveling layer 1 and abarrier layer 2 on a substrate (not shown), and forming an anodeelectrode 3 on the barrier layer 2 and also a cathode electrode 4thereon so as to surround the anode electrode 3. Specifically, thecarrier traveling layer 1 is made of Al_(X)Ga_(1-X)N (0≦X<1) which is anon-doped nitride-based semiconductor, and the barrier layer 2 is madeof Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) which is a non-doped or n-typenitride-based semiconductor having a lattice constant smaller than thatof the carrier traveling layer 1.

The example of FIG. 1A shows that the planar shape of the anodeelectrode 3 is a circle, and that the planar shape of the cathodeelectrode 4 is a circular ring shape formed at a position apart from aperipheral portion 3 b of the anode electrode 3 by a predetermineddistance so as to surround the anode electrode 3. However, any shape maybe used if the cathode electrode 4 surrounds the anode electrode 3. Itis noted that the carrier traveling layer 1 corresponds to a firstnitride-based semiconductor layer, and similarly, the barrier layer 2corresponds to a second nitride-based semiconductor layer, the anodeelectrode 3 corresponds to a first electrode, and the cathode electrode4 corresponds to a second electrode, in the appended claims.

A recess structure 7 is formed by removing a part of the barrier layer 2at the position on the barrier layer 2 corresponding to the peripheralportion 3 b which is more outward than a central portion 3 a of theanode electrode 3. An insulating film 5 is formed between thecircumference of a region surrounded by the recess structure 7 in thebarrier layer 2 and the position where the cathode electrode 4 isformed. However, all the region surrounded by the recess structure 7 inthe barrier layer 2 is not covered with the insulating film 5. With thisfeature, the anode electrode 3 is directly formed on the barrier layer 2in its central portion 3 a, but is formed on the barrier layer 2,through the insulating film 5, in its peripheral portion 3 b which ismore outward than the central portion 3 a. In other words, the thicknessof the barrier layer 2 at the peripheral portion 3 b formed in therecess structure 7 is smaller than that at the central portion 3 a ofthe anode electrode 3. It is desirable to use a material, which enablesohmic contact with a nitride-based semiconductor material, for the anodeelectrode 3 and the cathode electrode 4, and it is also desirably to usethe same material as each other. As the material above, Ti, Al, Mo, andthe like can be exemplified. It is noted that the recess structure 7corresponds to a recess structure portion, in the appended claims.

In the nitride-based semiconductor device shown in FIG. 1A and FIG. 1B,the diode operations when a negative voltage is applied to the anodeelectrode 3 and when a positive voltage is applied to the anodeelectrode 3 are explained below. The state of electrons at the interfacebetween the carrier traveling layer 1 and the barrier layer 2 of thenitride-based semiconductor device according to the first embodiment isexplained first. FIG. 2 is a schematic view of an energy state of aconduction band at the central portion of the anode electrode in FIG. 1Aand FIG. 1B. FIG. 3 is a graph of a relationship between the thicknessof the barrier layer and the carrier density in the nitride-basedsemiconductor device.

As explained in the Related Art, when the barrier layer 2 made ofAl_(Y)Ga_(1-Y)N (O<Y≦1, X<Y) film having the lattice constant smallerthan that of the carrier traveling layer 1 is epitaxially deposited onthe carrier traveling layer 1 made of Al_(X)Ga_(1-X)N (0≦X<1) film, thelattice constant of the Al_(Y)Ga_(1-Y)N forming the barrier layer 2becomes larger than its normal value, which leads to occurrence ofdistortion. Piezoelectric charge is produced in the barrier layer 2 dueto the piezo effect caused by the distortion in the barrier layer 2, anda two-dimensional electron gas is formed at the interface between thecarrier traveling layer 1 and the barrier layer 2 due to thepiezoelectric charge produced. As also explained in the Related Art, thecarrier density of the two-dimensional electron gas can be controlled bythe film thickness d₁ of the barrier layer 2. In other words, thepiezoelectric charge depends on the film thickness d₁ of the barrierlayer 2, and, as shown in FIG. 3, the carrier density increases as thefilm thickness d₁ of the barrier layer 2 is increased. Therefore, therecess structure 7 in the barrier layer 2 formed at a portioncorresponding to the peripheral portion 3 b of the anode electrode 3causes the thickness d₁ of the barrier layer 2 at the portion to bereduced as compared with that of the other portions. The carrier densityof the two-dimensional electron system below the recess structure 7thereby becomes low.

FIG. 4 is a schematic view of a case where reverse bias is applied tothe anode electrode of the nitride-based semiconductor device of FIG.1B. When the anode electrode 3 is applied with a negative voltage to bein reverse bias, the peripheral portion 3 b of the anode electrode 3formed in the recess structure 7 serves as a role similar to a gateelectrode of a field effect transistor 12, and a depletion layer 6 isformed near the position in the barrier layer 2 corresponding to theperipheral portion 3 b of the anode electrode 3, through the insulatingfilm 5. Because the depletion layer 6 develops in a portion where thecarrier density is low, it develops near the recess structure 7 wherethe thickness of the barrier layer 2 is thin. The depletion layer 6electrically insulates the anode electrode 3 from the cathode electrode4, thus the nitride-based semiconductor device shown in FIG. 4 is turnedto the off-state. The electric field is concentrated near the end of therecess structure 7 on its cathode electrode 4 side.

When the anode electrode 3 is applied with a positive voltage to be inforward bias, the forward bias is also applied to the two-dimensionalelectron system below the recess structure 7 of the barrier layer 2.This causes the carrier density of the two-dimensional electron systembelow the recess structure 7 to increase and the resistance in thisregion to decrease, and the nitride-based semiconductor device shown inFIGS. 1A and 1B is turned to the on-state.

FIG. 5 is a schematic view of the cross-sectional structure of theconventional nitride-based semiconductor device using a Schottkycontact. The conventional nitride-based semiconductor device is obtainedby successively laminating a carrier traveling layer 201 made ofAl_(X)Ga_(1-X)N (0≦X<1) which is a non-doped nitride-basedsemiconductor, and a barrier layer 202 made of Al_(Y)Ga_(1-Y)N (0<Y≦1,X<Y) which is a non-doped or n-type nitride-based semiconductor having alattice constant smaller than that of the carrier traveling layer 201,on a substrate (not shown), and by forming an anode electrode 203 havinga Schottky contact and a cathode electrode 204 having an ohmic contactarranged so as to surround the anode electrode 203, on the barrier layer202. In the conventional example of FIG. 5, the thickness of the barrierlayer 202 below the anode electrode 203 and the thickness thereof belowthe cathode electrode 204 are the same as each other.

In the conventional nitride-based semiconductor device, when the reversebias is applied to the anode electrode 203 having the Schottky contact,the electric field is concentrated on the edge of the anode electrode203, and a reverse-bias leak current thereby increases. Therefore, it isdifficult to reduce the reverse-bias leak current. Further, when theforward bias is applied to the anode electrode 203 having the Schottkycontact, because the anode electrode 203 is Schottky-contacted with thenitride-based semiconductor (barrier layer 202), it is difficult toreduce the on-state voltage to a value not more than the Schottkybarrier height.

In the first embodiment, on the other hand, when the reverse bias isapplied to the anode electrode 3, because the insulating film 5 isformed below the peripheral portion 3 b (recess structure 7) of theanode electrode 3 where the electric field is concentrated, thedepletion layer 6 is formed around the recess structure 7 as shown inFIG. 4, to enable minimization of the reverse-bias leak current fromflowing on the barrier layer 2. Furthermore, when the forward bias isapplied to the anode electrode 3, the anode electrode 3 and the cathodeelectrode 4 can be in ohmic contact with the two-dimensional electronsystem, thus realizing a low on-state voltage.

In the first embodiment, to suppress the reverse-bias leak current to below, it is desirable that the two-dimensional electron system below therecess structure 7 be depleted when the potential of the anode electrode3 is equal to that of the cathode electrode 4. With this feature, byapplying a slight amount of negative bias to the anode electrode 3, thedepletion layer 6 extends from the end of the recess structure 7 on itscathode electrode 4 side to the side of the cathode electrode 4, thussuppressing the reverse-bias leak current.

The condition for not producing the two-dimensional electron systembelow the peripheral portion 3 b of the anode electrode 3 or fordepleting the two-dimensional electron system below the recess structure7 in the nitride-based semiconductor device according to the firstembodiment is explained below. In the nitride-based semiconductor deviceshown in FIG. 1B, the critical thickness Tc of the barrier layer 2 inwhich the carrier is generated below the peripheral portion 3 b of theanode electrode 3 is represented by the following equation (3).

T _(c)=16.4×(1−1.27×(Y−X))/(Y−X) [Å]  (3)

In the equation (3), Y is the Al composition of the barrier layer 2, Xis the Al composition of the carrier traveling layer 1. The reason whythe critical thickness Tc becomes the function of Y−X in the equation(3) is because the difference in the lattice constant between thecarrier traveling layer 1 and the barrier layer 2 can be represented asthe difference in the composition ratio between the two. FIG. 6 is agraph of a relationship between a critical thickness and a difference ina composition ratio between the carrier traveling layer and the barrierlayer. FIG. 6 shows the equation (3) in the form of a graph representinga state in which the critical thickness Tc depends upon the Alcomposition. From this relationship, by reducing the thickness of thebarrier layer 2 at the position where the recess structure 7 is formed,to a value not more than the critical thickness Tc, the carrier densityof the two-dimensional electron system formed below the peripheralportion 3 b of the anode electrode 3 can be made zero. In this case,however, the condition of Y−X<1/1.27 (=0.787) should be satisfied,considering the condition in which the critical thickness Tc has to bepositive in the equation (3). Therefore, the thickness of the barrierlayer 2 below the recess structure 7 is desirably set to a value notmore than the critical thickness Tc represented by the equation (3).

The method of manufacturing the nitride-based semiconductor device shownin FIG. 1A and FIG. 1B is explained below. FIG. 7A to FIG. 7G areschematic cross-sectional views of one example of a procedure for themethod of manufacturing the nitride-based semiconductor device accordingto the first embodiment. At first, as shown in FIG. 7A, the carriertraveling layer 1 made of a non-doped Al_(X)Ga_(1-X)N (0≦X<1) film ofabout 2 micrometers (μm) and the barrier layer 2 made of a non-doped orn-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) film of about 20 nanometers (nm) aresuccessively grown on a substrate (not shown) on which a predeterminedfilm is formed as required. The carrier traveling layer 1 and thebarrier layer 2 are formed by using epitaxial crystal growth techniquesuch as Metal Organic Chemical Vapor Deposition (MOCVD) that can controla film thickness at a level of atomic layer.

Because the Al composition Y of the barrier layer 2 is larger than theAl composition X of the carrier traveling layer 1 (X<Y), the latticeconstant of the barrier layer 2 becomes smaller than that of the carriertraveling layer 1. The barrier layer 2 is epitaxially grown on thecarrier traveling layer 1, but the film thickness of the barrier layer 2is thinner than the film thickness in which dislocation occurs.Therefore, the crystal of the semiconductor film that forms the barrierlayer 2 is grown according to the crystal structure of the lower layer,extended in the direction parallel to the growth surface, and has adistortion.

As shown in FIG. 7B, a photoresist film 15 a is applied to the barrierlayer 2, and the photoresist film 15 a is exposed and developed by aphotolithography technique to form an etching mask obtained by removingthe photoresist film 15 a at the position where the recess structure 7is formed. This etching mask is the one such that the portioncorresponding to the peripheral portion 3 b of the anode electrode 3 isremoved as a circular ring shape when the etching mask has the structureof the anode electrode 3 shown in FIG. 1A, for example.

As shown in FIG. 7C, by using the etching mask, the barrier layer 2 isselectively removed to a predetermined depth by an etching techniquesuch as a reactive ion etching (RIE) method, to form the recessstructure 7. Thereafter, the etching mask (photoresist film 15 a) usedis removed.

As shown in FIG. 7D, the insulating film 5 having a predeterminedthickness is formed over the whole surface of the barrier layer 2 inwhich the recess structure 7 has been formed, and then, a photoresistfilm 15 b is applied to the insulating film 5. Thereafter, thephotoresist film 15 b is exposed and developed by the photolithographytechnique, and is removed from the regions where the anode electrode 3and the cathode electrode 4 are formed on the barrier layer 2 to formthe etching mask. When the nitride-based semiconductor device has thestructure as shown in FIG. 1A and FIG. 1B, the photoresist film 15 bnear the central portion 3 a, of the anode electrode 3, which directlycontacts the barrier layer 2 is removed.

As shown in FIG. 7E, a part of the insulating film 5 is selectivelyremoved by the technique such as the reactive ion etching method withthe etching mask, and then, the etching mask (photoresist film 15 b) isremoved. Thereafter, as shown in FIG. 7F, a new photoresist film 15 c isapplied to the barrier layer 2 on a part of which the insulating film 5is formed, and the photoresist film 15 c in the respective regions wherethe anode electrode 3 and the cathode electrode 4 are formed is removed.

As shown in FIG. 7G, a conductive material film 16 for electrodes isdeposited on the insulating film 5 where the photoresist film 15 c isformed and on the barrier layer 2. Specifically, the conductive materialfilm 16 is made of a conductive material such as metal and alloy ofwhich the anode electrode 3 and the cathode electrode 4 are made. Thephotoresist film 15 c and the conductive material film 16 at positionsother than the positions, where the anode electrode 3 and the cathodeelectrode 4 are formed, are removed by using a lift-off method, tothereby form the anode electrode 3 and the cathode electrode 4, and thenitride-based semiconductor device shown in FIG. 1A and FIG. 1B ismanufactured.

As explained above, in the first embodiment, there is no need to use aSchottky contact material for the anode electrode 3, but an ohmiccontact material can be used instead. Therefore, the same electrodematerial can be used for both the anode electrode 3 and the cathodeelectrode 4. With this feature, the anode electrode 3 and the cathodeelectrode 4 can be simultaneously formed, and the number ofmanufacturing steps can thereby be reduced, which allows manufacture ofthe nitride-based semiconductor device with a diode structure in asimpler manner.

The nitride-based semiconductor device shown in FIG. 1A and FIG. 1B isonly one example, and therefore, it may have another structure. FIG. 8to FIG. 11 are schematic views of modifications of the nitride-basedsemiconductor device according to the first embodiment. In the followingexplanation, the same components are assigned with the same referenceletters or numerals corresponding to those in FIG. 1A and FIG. 1B, andexplanation thereof is omitted.

FIG. 8 and FIG. 9 are cross-sectional views of other examples of thenitride-based semiconductor device according to the first embodiment.The nitride-based semiconductor devices shown in FIG. 8 and FIG. 9 arethe same as each other in a point that the recess structure 7 is formedat the position on the barrier layer 2 corresponding to the peripheralportion 3 b of the anode electrode 3, similarly to FIG. 1B. In the caseof FIG. 8, however, an edge 3 c of the peripheral portion 3 b of theanode electrode 3 is located in the recess structure 7, and it isdifferent from FIG. 1B that the edge 3 c is formed not on the whole areaof the recess structure 7. In the case of FIG. 9, the edge 3 c of theperipheral portion 3 b is protruded from the recess structure 7 toward aside of the cathode electrode 4, and this is different from FIG. 1B.Even if the nitride-based semiconductor devices are structured as shownin FIG. 8 and FIG. 9, respectively, the diode operation becomespossible. Therefore, if the anode electrode 3 is formed in at least apart of the recess structure 7 in its width direction, the on-state orthe off-state of the nitride-based semiconductor device can becontrolled by applying the forward bias or the reverse bias to the anodeelectrode 3. In other words, if the peripheral portion 3 b of the anodeelectrode 3 is positioned in the recess structure 7, the nitride-basedsemiconductor device capable of diode operation can be freely designed.

FIG. 10 is a plan view of another example of the nitride-basedsemiconductor device according to the first embodiment. In thisnitride-based semiconductor device, the recess structure 7 does notfully surround the central portion 3 a of the anode electrode 3, but anelement separating region (device isolating region) 8 and the recessstructure 7 surround the anode electrode 3, which is a different pointfrom FIG. 1A. The element separating region 8 is formed to electricallyseparate the region where the diode is formed from another elementforming region, and formed by ion-implantation of nitrogen (N⁺), helium(He⁺), or proton (H⁺) to the substrate where the carrier traveling layer1 and the barrier layer 2 are laminated, or by the substrate beingsubjected to mesa etching. Here, the element separating region 8 isformed in contact with the anode electrode 3, the cathode electrode 4,and even the insulating film 5. In the example of FIG. 10, the anodeelectrode 3 is formed so as to be in contact with one side of theelement separating region 8 formed on the substrate.

The anode electrode 3 extends in the direction perpendicular to one sideof the element separating region 8 in contact therewith, and the edge ofthe anode electrode 3 opposite to the edge in contact with the elementseparating region 8 is formed into a semicircular arc. The cathodeelectrode 4 having a reverse U-shape is formed, so as to surround theanode electrode 3, at the position apart from the edge of the anodeelectrode 3 by a predetermined distance so that both the edges of thecathode electrode 4 are in contact with the one side of the elementseparating region 8. The recess structure 7 having a substantiallyreverse U-shape is formed at a region of the barrier layer 2corresponding to the peripheral portion 3 b of the anode electrode 3which does not contact the element separating region 8. The insulatingfilm 5 is formed so as to cover the barrier layer 2 between thecircumference of the barrier layer 2 surrounded by the recess structure7 and the edge of the cathode electrode 4 on its anode electrode 3 sidethrough the recess structure 7. In this case also, the central portion 3a of the anode electrode 3 directly contacts the barrier layer 2 and theperipheral portion 3 b thereof contacts the insulating film 5 formed onthe barrier layer 2 so that at least a part of the peripheral portion 3b is formed in a part of the recess structure 7 in its width direction.

Because a current does not flow by nature in the element separatingregion 8 where no two-dimensional electron system exists, there is noneed to provide the recess structure 7 therein. Therefore, bysurrounding the anode electrode 3 by the recess structure 7 and theelement separating region 8, the effect of the nitride-basedsemiconductor device with the diode structure is obtained. Further,because no two-dimensional electron system exists in the elementseparating region 8, the electric field concentration hardly occurs.Therefore, by structuring the nitride-based semiconductor device asshown in FIG. 10, a stable breakdown voltage can be obtained.

FIG. 11 is a cross-sectional view of another example of thenitride-based semiconductor device according to the first embodiment.The nitride-based semiconductor device of FIG. 11 has the anodeelectrode 3 formed with two kinds of conductive materials, based on FIG.1A and FIG. 1B. More specifically, the anode electrode 3 includes afirst anode electrode 31 and a second anode electrode 32. The firstanode electrode 31 is made of a conductive material such as a metalhaving low contact resistance (Ohmic contact) against the nitride-basedsemiconductor at the central portion 3 a where the anode electrode 3directly contacts the barrier layer 2. The second anode electrode 32 ismade of a conductive material such as a metal having high adhesion tothe insulating film 5 in the peripheral portion 3 b formed on theinsulating film 5 except the central portion 3 a. In this manner, themetal (Ti, Al, Mo, etc.) having low contact resistance against thenitride-based semiconductor is used for the first anode electrode 31,while the metal (Ti or Ni) having high adhesion to the insulator is usedfor the second anode electrode 32, and it is thereby possible tomanufacture the nitride-based semiconductor device having the diodestructure with good yield while keeping low on-resistance. Theconductive material forming the second anode electrode 32 may be anymaterial if it has good adhesion to the insulating film 5.

According to the first embodiment, it is possible to provide thenitride-based semiconductor device capable of operating as a diodehaving a low on-state voltage and a low reverse-bias leak current.

FIG. 12 is a schematic cross-sectional view of a nitride-basedsemiconductor device according to a second embodiment. The planarstructure of the nitride-based semiconductor device is assumed, as shownin FIG. 10, that the anode electrode 3 is surrounded by the recessstructure 7 and the element separating region 8. In the nitride-basedsemiconductor device shown in FIG. 12, an insulating film 9 is formedover the whole surface of the nitride-based semiconductor device havingthe cross-sectional structure shown in FIG. 1B, and a field plateelectrode 10 is formed on the insulating film 9. The cross-section ofthe field plate electrode 10 is such that its edge is located in betweenthe edge of the anode electrode 3 and the edge of the cathode electrode4 on its anode electrode 3 side.

When the anode electrode 3 of the nitride-based semiconductor device isapplied with reverse bias to be turned to the off-state, the electricfield concentration occurring near the anode electrode 3 is relieved bythe field plate electrode 10. This allows improvement of off-breakdownvoltage. To relieve the electric field concentration, the field plateelectrode 10 is desirably connected to the anode electrode 3 or to thecathode electrode 4.

According to the second embodiment, it is possible to provide thenitride-based semiconductor device capable of operating as the diodehaving a low on-state voltage and a low reverse-bias leak current whilethe electric field concentration to the edge of the anode electrode 3 isrelieved to implement a high breakdown voltage.

FIG. 13A is a schematic plan view of a nitride-based semiconductordevice according to a third embodiment. FIG. 13B is a cross-sectionalview taken along the line B-B of FIG. 13A. The nitride-basedsemiconductor device is structured to form a diode 11 which areexplained in the first embodiment and a field effect transistor 12 onthe same substrate. Hereinafter, a region on the substrate where thediode 11 is formed is called “diode forming region R_(D)”, and a regionwhere the field effect transistor 12 is formed is called “transistorforming region R_(TR)”.

The nitride-based semiconductor device has a structure (hereinafter,“laminated body”) in which the carrier traveling layer 1 made ofAl_(X)Ga_(1-X)N (0≦X<1) being a non-doped nitride-based semiconductor,and the barrier layer 2 made of Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) being anon-doped or n-type nitride-based semiconductor having a latticeconstant smaller than that of the carrier traveling layer 1 aresuccessively laminated on a substrate (not shown). Here, the carriertraveling layer 1 corresponds to the first nitride-based semiconductorlayer, and similarly, the barrier layer 2 corresponds to the secondnitride-based semiconductor layer, in the appended claims.

The diode 11 is formed in the diode forming region R_(D) of thelaminated body, but has basically the same structure as that in thefirst embodiment, and therefore, explanation of the details is omitted.However, the example of FIG. 13A shows that the planar shape of theanode electrode 3 is a rectangle and the planar shape of the cathodeelectrode 4 is a rectangular frame (like a picture frame) which isprovided apart from the peripheral portion 3 b of the anode electrode 3by a predetermined distance and surrounds the anode electrode 3. A partof the cathode electrode 4 formed in its transistor forming regionR_(TR) side serves also as a source electrode 4 b of the field effecttransistor 12. Here, the anode electrode 3 corresponds to the firstelectrode and the cathode electrode 4 corresponds to the secondelectrode, in the appended claims.

The field effect transistor 12 is formed in the transistor formingregion R_(TR) of the laminated body, and the source electrode 4 b servesalso as a part of the cathode electrode 4 of the diode 11. Anotherrecess structure 7 obtained by removing a part of the barrier layer 2 isformed at the position on the barrier layer 2 where a gate electrode 13is formed. The recess structure 7 is formed almost parallel to thedirection to which the source electrode 4 b is formed. Further, a drainelectrode 14 is formed at the position on the barrier layer 2 which isalmost symmetric to the source electrode 4 b with respect to this recessstructure 7, and formed almost parallel to the direction to which thesource electrode 4 b is formed. An insulating film 5 is formed on thebarrier layer 2 including the recess structure 7 between the sourceelectrode 4 b and the drain electrode 14. The insulating film 5 servesas a gate insulating film in the recess structure 7, and the gateelectrode 13 is formed on this insulating film 5.

Because the operation of the diode 11 is as explained in the firstembodiment, the explanation thereof is omitted herein, and the outlineof the operation of the field effect transistor 12 is explained below.Similarly to the diode 11, the field effect transistor 12 is also formedon the laminated body in which the carrier traveling layer 1 and thebarrier layer 2, of which lattice constant is smaller than that of thecarrier traveling layer 1, are laminated. Therefore, the two-dimensionalelectron gas is formed between the carrier traveling layer 1 and thebarrier layer 2 by piezoelectric charge due to distortion of the barrierlayer 2. When a negative voltage is applied to the gate electrode 13formed on the recess structure 7 in the barrier layer 2, a depletionlayer is formed in the barrier layer 2 below the gate electrode 13,similarly to the peripheral portion 3 b of the anode electrode 3 in thediode explained with reference to FIG. 4, which prevents movement ofelectrons. This causes the carrier not to flow between the sourceelectrode 4 b and the drain electrode 14. On the other hand, when apositive voltage is applied to the gate electrode 13, the carrier isinjected into the barrier layer 2 below the gate electrode 13, whichcauses the carrier to flow between the source electrode 4 b and thedrain electrode 14. The transistor operation of the field effecttransistor 12 is performed by turning on/off the voltage to be appliedto the gate electrode 13 in the above manner.

The method of manufacturing the nitride-based semiconductor device, inwhich the diode 11 and the field effect transistor 12 shown in FIG. 13Aand FIG. 13B are formed on the same substrate, is explained below. FIG.14A to FIG. 14I are schematic cross-sectional views of one example of aprocedure for the method of manufacturing the nitride-basedsemiconductor device according to the third embodiment. At first, asshown in FIG. 14A, the carrier traveling layer 1 and the barrier layer 2are successively grown in the diode forming region R_(D) and thetransistor forming region R_(TR) on a substrate (not shown) on which apredetermined film is formed if necessary. Specifically, the carriertraveling layer 1 is made of a non-doped Al_(X)Ga_(1-X)N (0≦X<1) film ofabout 2 μm, and the barrier layer 2 is made of a non-doped or n-typeAl_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) film of about 20 nm. The carrier travelinglayer 1 and the barrier layer 2 are formed by using the epitaxialcrystal growth technique such as the MOCVD method that can control thefilm thickness at a level of atomic layer. The film thickness of thebarrier layer 2 needs to be thinner than the film thickness in whichdislocation occurs. Therefore, the crystal of a semiconductor film thatforms the barrier layer 2 is grown according to the crystal structure ofthe carrier traveling layer 1 as the lower layer, extended in thedirection parallel to the growth surface, and has a distortion.

As shown in FIG. 14B, a photoresist film 15 d is applied to the barrierlayer 2, and the photoresist film 15 d is exposed and developed by thephotolithography technique, to form an etching mask obtained by removingthe photoresist film 15 d at the position where the recess structure 7is formed.

As shown in FIG. 14C, by using the etching mask, parts of the barrierlayer 2 are selectively removed to a predetermined depth by thetechnique such as the reactive ion etching method, to form the recessstructure 7. Then, the photoresist film 15 d used is removed.

As shown in FIG. 14D, the insulating film 5 is formed over the wholesurface of the barrier layer 2, and then, a photoresist film 15 e isapplied to the insulating film 5. Thereafter, the photoresist film 15 eis exposed and developed by the photolithography technique so that thephotoresist film 15 e in regions corresponding to electrodes directlyformed on the barrier layer 2 is removed, to form an etching mask.Specifically, the electrodes are the cathode electrode 4 (including thesource electrode 4 b in the field effect transistor 12) and the centralportion 3 a of the anode electrode 3 in the diode 11, and the drainelectrode 14 in the field effect transistor 12.

As shown in FIG. 14E, parts of the insulating film 5 are selectivelyremoved by the technique such as the reactive ion etching method usingthe etching mask, the barrier layer 2 is exposed, and then, thephotoresist film 15 e is removed.

As shown in FIG. 14F, a new photoresist film 15 f is applied to theentire surface of the barrier layer 2 on a part of which the insulatingfilm 5 is formed, and then, the photoresist film 15 f is exposed anddeveloped by the photolithography technique to remove the photoresistfilm 15 f in the predetermined regions corresponding to the positionswhere the electrodes are formed. In this case, the photoresist film 15 fis removed from the regions in the diode 11 where the anode electrode 3and the cathode electrode 4 (including the source electrode 4 b in thefield effect transistor 12) are formed and from the region in the fieldeffect transistor 12 where the drain electrode 14 is formed.

As shown in FIG. 14G, a conductive material film 16 a for electrodes isdeposited, by a predetermined thickness, on the entire surface in theside where the photoresist film 15 f is formed. Specifically, theconductive material film 16 a is metal or the like of which the anodeelectrode 3, the cathode electrode 4 (including the source electrode 4b), and the drain electrode 14 are made. Thereafter, the photoresistfilm 15 f and the conductive material film 16 a are removed, by usingthe lift-off method, from regions other than the regions where the anodeelectrode 3, the cathode electrode 4 (including the source electrode 4b), and the drain electrode 14 are formed. The anode electrode 3, thecathode electrode 4 (including the source electrode 4 b), and the drainelectrode 14 are thereby formed with the conductive material film 16 aremaining.

As shown in FIG. 14H, a new photoresist film 15 g is applied on thesurface in the side where the electrodes are formed, and then, thephotoresist film 15 g is exposed and developed by the photolithographytechnique to remove the photoresist film 15 g in a predetermined regioncorresponding to the position where an electrode is formed. In thiscase, the photoresist film 15 g is removed from the region in the fieldeffect transistor 12 where the gate electrode 13 is formed.

As shown in FIG. 14I, a conductive material film 16 b for electrodessuch as metal, of which the gate electrode 13 is made, is deposited by apredetermined thickness on the entire surface in the side where thephotoresist film 15 g is formed. Thereafter, the photoresist film 15 gand the conductive material film 16 b are removed, by using the lift-offmethod, from regions other than the region where the gate electrode 13is formed. The gate electrode 13 is thereby formed with the conductivematerial film 16 b remaining. The nitride-based semiconductor device inwhich the diode 11 and the field effect transistor 12 shown in FIG. 13Aand FIG. 13B are formed on the same substrate is obtained in the abovemanner.

In the method of manufacturing the nitride-based semiconductor device,the recess structure 7 below the peripheral portion 3 b of the anodeelectrode 3 in the diode 11 and the recess structure 7 below the gateelectrode 13 in the field effect transistor 12 can be simultaneouslyformed. Moreover, the insulating film 5 provided between the peripheralportion 3 b of the anode electrode 3 in the diode 11 and the barrierlayer 2, and the gate insulating film (insulating film 5) provided forthe gate electrode 13 in the field effect transistor 12 can be sharedand simultaneously formed. This allows reduction in the number ofmanufacturing processes.

In the process of forming the recess structure 7, to make the density ofthe two-dimensional electron gas zero in this region and minimize thereverse-bias leak current, the thickness of the barrier layer 2 belowthe recess structure 7 is desirably set to a value not more than thecritical thickness Tc represented by the equation (3).

In the above example, the electrode shared for both the cathodeelectrode 4 and the source electrode 4 b is used, but some electrodesamong the anode electrode 3, the cathode electrode 4, the sourceelectrode 4 b, the gate electrode 13, and the drain electrode 14 may befreely combined for sharing or such sharing does not have to be donedepending on circuit design.

According to the third embodiment, it is possible to form a circuitdevice, which combines the diode 11 and the field effect transistor 12,on the same substrate by using a wide-gap semiconductor device with highbreakdown voltage and low loss. As a result, when the circuit device isused for a circuit such as an inverter, the circuit device with low lossand high breakdown voltage can be provided. Furthermore, by forming thediode 11 and the field effect transistor 12 on the same substrate, thenumber of components can be largely reduced.

FIG. 15 is a schematic cross-sectional view of a nitride-basedsemiconductor device according to a fourth embodiment. The nitride-basedsemiconductor device is such that the carrier traveling layer 1 made ofAl_(X)Ga_(1-X)N (0≦X<1) being a non-doped nitride-based semiconductor,the barrier layer 2 made of Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) being anon-doped or n-type nitride-based semiconductor having a latticeconstant smaller than that of the carrier traveling layer 1, athreshold-voltage control layer 21, and a carrier inducing layer 22 aresuccessively laminated on a substrate (not shown). Specifically, thethreshold-voltage control layer 21 is made of a non-doped or n-typesemiconductor having a lattice constant equal to that of the carriertraveling layer 1, and the carrier inducing layer 22 is made of anon-doped or n-type semiconductor having a lattice constant smaller thanthat of the carrier traveling layer 1. The anode electrode 3 and thecathode electrode 4 which surrounds the anode electrode 3 are formed onthe carrier inducing layer 22. The planar structure corresponding to thecross-section of the nitride-based semiconductor device of FIG. 15 is,for example, the structure as shown in FIG. 1A.

More specifically, the planar shape of the anode electrode 3 is acircle, and the planar shape of the cathode electrode 4 is a circularring shape formed spaced from the peripheral portion 3 b of the anodeelectrode 3 by a predetermined distance so as to surround the anodeelectrode 3. However, this is only one example, and therefore, any shapemay be used if the anode electrode 3 is surrounded by the cathodeelectrode 4 or by the cathode electrode 4 and the element separatingregion 8. Furthermore, it is desirable to use any material capable ofohmic contact with the nitride-based semiconductor, for the anodeelectrode 3 and the cathode electrode 4.

The recess structure 7 is formed by removing the whole of the carrierinducing layer 22 and a part of the threshold-voltage control layer 21,at the position on the carrier inducing layer 22 corresponding to theperipheral portion 3 b which is provided outwardly of the centralportion 3 a of the anode electrode 3. The insulating film 5 is formedbetween the circumference of the region surrounded by the recessstructure 7 in the carrier inducing layer 22 and the position where thecathode electrode 4 is formed. However, all the region surrounded by therecess structure 7 in the carrier inducing layer 22 should not becovered with the insulating film 5. With this feature, the anodeelectrode 3 is directly formed on the carrier inducing layer 22 in itscentral portion 3 a, but is formed on the threshold-voltage controllayer 21, through the insulating film 5, in its peripheral portion 3 bwhich is more outward (the recess structure 7 in the barrier layer 2)than the central portion 3 a. As a result, the carrier inducing layer 22in the peripheral portion 3 b is removed to make lower thetwo-dimensional electron density below the peripheral portion 3 b thanthat below the central portion 3 a of the anode electrode 3.

In FIG. 15, the recess structure 7 is structured by removing the wholeof the carrier inducing layer 22 and a part of the threshold-voltagecontrol layer 21 in the region corresponding to the peripheral portion 3b of the anode electrode 3. However, the recess structure 7 may also bestructured by removing only the carrier inducing layer 22 because thenitride-based semiconductor device according to the fourth embodimentcan be operated as a diode as long as the recess structure 7 is notformed in the barrier layer 2 and the carrier inducing layer 22 isremoved. In the example of FIG. 15, the central portion 3 a of the anodeelectrode 3 and the cathode electrode 4 in the diode 11 are formed onthe carrier inducing layer 22, but are only necessary to be formed inany one of the carrier inducing layer 22, the threshold-voltage controllayer 21, and the barrier layer 2. Here, the carrier traveling layer 1corresponds to the first nitride-based semiconductor layer , andsimilarly, the barrier layer 2 corresponds to the second nitride-basedsemiconductor layer, the threshold-voltage control layer 21 correspondsto a first semiconductor layer, the carrier inducing layer 22corresponds to a second semiconductor layer, the anode electrode 3corresponds to the first electrode, and the cathode electrode 4corresponds to the second electrode, in the appended claims.

As explained above, the threshold-voltage control layer 21 is formedwith a semiconductor material having the same lattice constant as thatof the carrier traveling layer 1. However, as shown in FIG. 15, if thethreshold-voltage control layer 21 and the carrier traveling layer 1 aremade of the same material such as Al_(X)Ga_(1-X)N (0≦X<1), both thelayers can be manufactured by one type of crystal growth apparatus.Therefore, using the same material is more advantageous as compared withmaterials which are different from each other but have the same latticeconstant. Similarly, the carrier inducing layer 22 is formed with asemiconductor material having the lattice constant smaller than that ofthe carrier traveling layer 1. However, as shown in FIG. 15, ifAl_(Z)Ga_(1-Z)N (0<Z≦1, X<Z) film is used, crystal growth is possible byusing the same material as that of the barrier layer 2. Consequently,using the same material is more advantageous as compared with usingdifferent materials.

The thickness of the barrier layer 2 is set to a value not more than athickness in which dislocation occurs caused by distortion due to adifference in the lattice constant between the barrier layer 2 and thecarrier traveling layer 1, and actually, the barrier layer 2 has athickness of about tens of nanometers. Therefore, the lattice constantof the barrier layer 2 becomes substantially the same as that of thecarrier traveling layer 1, and the barrier layer 2 has a crystalstructure extended in the direction parallel to the substrate surface.This causes the threshold-voltage control layer 21 formed on the barrierlayer 2 to have the same lattice constant as that of the carriertraveling layer 1. Therefore, a new distortion does not occur betweenthe threshold-voltage control layer 21 and the barrier layer 2.

Similarly, the thickness of the carrier inducing layer 22 is set to avalue not more than a film thickness in which dislocation occurs causedby distortion due to a difference in the lattice constant between thecarrier inducing layer 22 and the threshold-voltage control layer 21,and actually, the carrier inducing layer 22 has a thickness of abouttens of nanometers. Therefore, the lattice constant of the carrierinducing layer 22 becomes substantially the same as that of thethreshold-voltage control layer 21, and the carrier inducing layer 22has a crystal structure extended in the direction parallel to thesubstrate surface. In the following explanation, it is assumed that d₁indicates the thickness of the barrier layer 2, d₂ indicates thethickness of the threshold-voltage control layer 21 at the positionwhere the recess structure 7 is formed, and d₃ indicates the thicknessof the carrier inducing layer 22.

The film thickness d₁ of the barrier layer 2 below the peripheralportion 3 b (recess structure 7) of the anode electrode 3 is madedifferent from the total thickness d₁+d₃ of the barrier layer 2 and thecarrier inducing layer 22 at the central portion 3 a of the anodeelectrode 3 or between the peripheral portion 3 b of the anode electrode3 and the cathode electrode 4. In other words, the thickness of theanode electrode 3 is designed to be different in the respective regionssuch as the central portion 3 a and the peripheral portion 3 b. Byvirtue of having such a construction, the two-dimensional electrondensity can be set to predetermined values in the respective regions.However, the total thickness d₁+d₃ of the barrier layer 2 and thecarrier inducing layer 22 needs to be larger than the critical thicknessTc in the equation (3), because the carrier needs to exist between theanode electrode 3 and the cathode electrode 4. Further, if the filmthickness d1 of the barrier layer 2 is set to a value not more than thecritical thickness Tc in the equation (3), the carrier density at theinterface between the barrier layer 2 and the carrier traveling layer 1below the peripheral portion 3 b (recess structure 7) of the anodeelectrode 3 can be made zero, thus minimizing the reverse-bias leakcurrent.

The method of manufacturing the nitride-based semiconductor deviceaccording to the fourth embodiment is the same as that explained in thefirst embodiment except for different points as explained below, andexplanation of the details is therefore omitted. One of the differentpoints is such that, unlike FIG. 7A, the carrier traveling layer 1 madeof a non-doped Al_(X)Ga_(1-X)N (0≦X<1) film of about 2 μm, the barrierlayer 2 made of a non-doped or n-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) filmof about 10 nm, the threshold-voltage control layer 21 made of anon-doped or n-type Al_(X)Ga_(1-X)N (0≦X<1) film of about 10 nm, and thecarrier inducing layer 22 made of a non-doped or n-type Al_(Z)Ga_(1-Z)N(0<Z≦1, X<Z) film of about 10 nm are successively grown on a substrate(not shown) on which a predetermined film is formed if necessary. Theother different point is such that, unlike FIG. 7C, when the recessstructure 7 is formed, the whole of the carrier inducing layer 22 and apart of the threshold-voltage control layer 21 are selectively removedto a predetermined depth in the threshold-voltage control layer 21.

However, the total thickness d₁+d₃ of the barrier layer 2 and thecarrier inducing layer 22 needs to be formed so as to be larger than thecritical thickness Tc in the equation (3). Further, to obtain thenitride-based semiconductor device that suppresses the reverse-bias leakcurrent, the film thickness d₁ of the barrier layer 2 below theperipheral portion 3 b (recess structure 7) of the anode electrode 3 issimply set to a value not more than the critical thickness Tc in theequation (3).

As explained above, in the fourth embodiment, the recess structure 7corresponding to the peripheral portion 3 b of the anode electrode 3 isformed not between the surface of the nitride-based semiconductor deviceand the part of the barrier layer 2, unlike the first embodiment, butbetween the surface of the nitride-based semiconductor device accordingto the fourth embodiment and the threshold-voltage control layer 21which is the upper layer of the barrier layer 2. Specifically, thenitride-based semiconductor device according to the fourth embodiment isobtained by successively laminating the carrier traveling layer 1, thebarrier layer 2 having the lattice constant smaller than that of thecarrier traveling layer 1, the threshold-voltage control layer 21 havingthe same lattice constant as that of the carrier traveling layer 1, andthe carrier inducing layer 22 having the lattice constant smaller thanthat of the carrier traveling layer 1, on the substrate. Furthermore,the total thickness d₁+d₃ Of the barrier layer 2 and the carrierinducing layer 22 is set to be larger than the critical thickness Tc inthe equation (3).

According to the fourth embodiment, in the nitride-based semiconductordevice in which the total thickness d₁+d₃ of the barrier layer 2 and thecarrier inducing layer 22 is larger than the critical thickness Tc inthe equation (3), the central portion 3 a of the anode electrode 3 isdirectly formed on the carrier inducing layer 22, the peripheral portion3 b is formed, through the insulating film 5, on the threshold-voltagecontrol layer 21 where the recess structure 7 is formed, and the cathodeelectrode 4 is formed on the carrier inducing layer 22. It is therebypossible to obtain the nitride-based semiconductor device capable ofoperating as the diode that can suppress the reverse-bias leak currentto a low level when the reverse bias is applied to the anode electrode3, and that has a low on-state voltage when the forward bias is appliedto the anode electrode 3. Furthermore, by setting the film thickness d₁of the barrier layer 2 to a value not more than the critical thicknessTc in the equation (3), the reverse-bias leak current can be suppressed.

In the field effect transistor 12 of the nitride-based semiconductordevice according to the third embodiment, the gate electrode 13 isformed on the recess structure 7 obtained by removing the part of thebarrier layer 2 using etching. However, in the field effect transistor12 having such a structure as above, a threshold voltage changesdepending on the Al composition ratio in the barrier layer 2 and thethickness of the barrier layer 2 below the gate electrode 13 (recessstructure 7). For example, when the Al composition ratio Y in thebarrier layer 2 is 0.3, even if processing is performed with a precisionof 10 [Å] on variation in the thickness of the barrier layer 2 below thegate electrode 13 caused by the etching for forming the recess structure7, the variation in the threshold voltage at this time becomes as largeas 0.3 [V]. In other words, in the nitride-based semiconductor deviceaccording to the third embodiment, if a plurality of field effecttransistors 12 are present on the same substrate, it takes acomparatively troublesome to suppress the variation in the thresholdvoltage. Therefore, in a fifth embodiment, a nitride-based semiconductordevice capable of suppressing the variation in the threshold voltage ofa plurality of diodes 11 and field effect transistors 12 formed on thesame substrate is explained below.

FIG. 16 is a schematic cross-sectional view of the nitride-basedsemiconductor device according to the fifth embodiment. Thenitride-based semiconductor device has the diode 11 explained in thefourth embodiment and the field effect transistor 12 which are formed onthe same substrate. Hereinafter, the region on the substrate where thediode 11 is formed is called “diode forming region R_(D)”, and theregion where the field effect transistor 12 is formed is called“transistor forming region R_(TR)”.

The nitride-based semiconductor device has a structure (hereinafter,“laminated body”) in which the carrier traveling layer 1 made ofAl_(X)Ga_(1-X)N (0≦X<1) being a non-doped nitride-based semiconductor,the barrier layer 2 made of Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) being anon-doped or n-type nitride-based semiconductor having the latticeconstant smaller than that of the carrier traveling layer 1, thethreshold-voltage control layer 21 made of a non-doped or n-typesemiconductor having the lattice constant equal to that of the carriertraveling layer 1, and the carrier inducing layer 22 made of a non-dopedor n-type semiconductor having the lattice constant smaller than that ofthe carrier traveling layer 1 are successively laminated on thesubstrate (not shown). Here, the carrier traveling layer 1 correspondsto the first nitride-based semiconductor layer, and similarly, thebarrier layer 2 corresponds to the second nitride-based semiconductorlayer, the threshold-voltage control layer 21 corresponds to the firstsemiconductor layer, and the carrier inducing layer 22 corresponds tothe second semiconductor layer, in the appended claims.

The diode 11 is formed in the diode forming region R_(D) of thelaminated body, but has basically the same structure as that explainedin the fourth embodiment, and therefore, explanation of its details isomitted. Here, the case where the planar structure corresponding to thecross-section of FIG. 16 is the one shown in FIG. 13A is exemplified.More specifically, it is shown that the planar shape of the anodeelectrode 3 is a rectangle and the planar shape of the cathode electrode4 is a rectangular frame (like a picture frame) which is provided apartfrom the peripheral portion 3 b of the anode electrode 3 by apredetermined distance so as to surround the anode electrode 3. A partof the cathode electrode 4 formed in its transistor forming regionR_(TR) side serves also as the source electrode 4 b of the field effecttransistor 12. Here, the anode electrode 3 corresponds to the firstelectrode and the cathode electrode 4 corresponds to the secondelectrode, in the appended claims.

The field effect transistor 12 is formed in the transistor formingregion R_(TR) of the laminated body, and the source electrode 4 b servesalso as a part of the cathode electrode 4 of the diode 11. The recessstructure 7 obtained by removing the whole of the carrier inducing layer22 and a part of the threshold-voltage control layer 21 is formed at theposition on the carrier inducing layer 22 where the gate electrode 13 isformed. The recess structure 7 is formed almost parallel to thedirection to which the source electrode 4 b is formed. Further, thedrain electrode 14 is formed at a position on the carrier inducing layer22 which is almost symmetric to the source electrode 4 b with respect tothis recess structure 7, and formed almost parallel to the direction towhich the source electrode 4 b is formed. The insulating film 5 isformed on the carrier inducing layer 22 including the recess structure 7between the source electrode 4 b and the drain electrode 14. Theinsulating film 5 serves as a gate insulating film in the recessstructure 7, and the gate electrode 13 is formed on this insulating film5.

Because the operation of the diode 11 is as explained in the first andthe fourth embodiments, the explanation thereof is omitted herein, andthe outline of the operation of the field effect transistor 12 isexplained below. FIG. 17 is a schematic view of an energy state of aconduction band in the depth direction at the position where the gateelectrode of FIG. 16 is formed. FIG. 18 is a schematic view of an energystate of a conduction band in the depth direction at the position wherethe source electrode 4 b or the drain electrode 14 of FIG. 16 is formed.

The peripheral portion 3 b of the anode electrode 3 is formed on thethreshold-voltage control layer 21, and, as shown in FIG. 17, apiezoelectric charge is thereby produced only in the barrier layer 2 butnot in the threshold-voltage control layer 21, at the position where theperipheral portion 3 b is formed. Therefore, the piezoelectric chargedensity does not depend on the film thickness d₂ of thethreshold-voltage control layer 21 below the peripheral portion 3 b ofthe anode electrode 3. Further, the piezoelectric charge density doesnot change. Consequently, the carrier density is reduced with respect toan increase in the film thickness of the threshold-voltage control layer21. In other words, it is known that the carrier density is inverselyproportional to the total thicknesses of the barrier layer 2 and thethreshold-voltage control layer 21. Meanwhile, a gate capacity per unitarea is inversely proportional to the total thickness of the barrierlayer 2 and the threshold-voltage control layer 21. From thisrelationship, the threshold voltage represented by [carrier density oftwo-dimensional electron system under gate electrode 13]/[gate capacityper unit area] does not vary with respect to the total thickness of thebarrier layer 2 and the threshold-voltage control layer 21.

Specifically, in the field effect transistor 12 of the nitride-basedsemiconductor device shown in FIG. 16, the threshold voltage does notvary with respect to the variation in the etching depth upon forming therecess structure 7. More specifically, the threshold voltage does notvary even if the film thickness d₂, which is left in thethreshold-voltage control layer 21, varies. Further, the barrier layer2, which is not removed upon forming the recess structure 7 as explainedlater, is formed by a film-forming technique that enables a crystalgrowth with atomic layer control, to thereby enable strictfilm-thickness control.

On the other hand, the carrier inducing layer 22 is formed in a regionbetween the source electrode 4 b and the gate electrode 13 and in aregion between the drain electrode 14 and the gate electrode 13, in bothof which the recess structure 7 is not formed. Because the carrierinducing layer 22 has the lattice constant smaller than that of thecarrier traveling layer 1 and the threshold-voltage control layer 21, asshown in FIG. 18, the piezoelectric charge that is positive at the sideof the threshold-voltage control layer 21 is produced in the carrierinducing layer 22. The potential of the conduction band in the carrierinducing layer 22 has a slope due to the piezoelectric charge, namely,the potential at the side of the carrier traveling layer 1 is low.

Similarly to FIG. 17, the piezoelectric charge is also produced in thebarrier layer 2. Therefore, the carrier density of the two-dimensionalelectron system increases at the interface between the carrier travelinglayer 1 and the barrier layer 2 below the region where the carrierinducing layer 22 is formed. Specifically, the resistance of thetwo-dimensional electron system below the region where the carrierinducing layer 22 is formed decreases. As a result, in the nitride-basedsemiconductor device of FIG. 16 in which the carrier inducing layer 22is formed between the source electrode 4 b and the gate electrode 13 andbetween the drain electrode 14 and the gate electrode 13, the resistancebetween the source electrode 4 b and the gate electrode 13 and betweenthe drain electrode 14 and the gate electrode 13 is reduced, wherebyreduced on-resistance can be realized.

The method of manufacturing the nitride-based semiconductor deviceaccording to the fifth embodiment is the same as that explained in thethird embodiment except for different points as explained below, andexplanation of the details is therefore omitted. One of the differentpoints is such that, unlike FIG. 14A, the carrier traveling layer 1 madeof a non-doped Al_(X)Ga_(1-X)N (0≦X<1) film of about 2 μm, the barrierlayer 2 made of a non-doped or n-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y) filmof about 10 nm, the threshold-voltage control layer 21 made of anon-doped or n-type Al_(X)Ga_(1-X)N (0≦X<1) film of about 10 nm, and thecarrier inducing layer 22 made of a non-doped or n-type Al_(Z)Ga_(1-Z)N(0<Z≦1, X<Z) film of about 10 nm are successively grown on a substrate(not shown) where a predetermined film is formed if necessary. The otherdifferent point is such that, unlike FIG. 14C, when the recess structure7 is formed, the whole of the carrier inducing layer 22 and a part ofthe threshold-voltage control layer 21 are selectively removed to apredetermined depth in the threshold-voltage control layer 21.

However, the total thickness d₁+d₃ of the barrier layer 2 and thecarrier inducing layer 22 needs to be formed so as to be larger than thecritical thickness Tc in the equation (3). Further, to obtain thenitride-based semiconductor device that suppresses the reverse-bias leakcurrent, the film thickness d₁ of the barrier layer 2 below theperipheral portion 3 b (recess structure 7) of the anode electrode 3 issimply set to a value not more than the critical thickness Tc in theequation (3). Consequently, the field effect transistor 12 can bechanged to a normally off-type.

In the above example, the electrode that serves as both the cathodeelectrode 4 and the source electrode 4 b is used, but some electrodesamong the anode electrode 3, the cathode electrode 4, the sourceelectrode 4 b, the gate electrode 13, and the drain electrode 14 may befreely combined for sharing or such sharing does not have to be donedepending on circuit design. Further, in FIG. 16, the recess structure 7is formed by removing the whole of the carrier inducing layer 22 and apart of the threshold-voltage control layer 21 from the region in thediode 11 corresponding to the peripheral portion 3 b of the anodeelectrode 3 as well as from the position in the field effect transistor12 where the gate electrode 13 is formed. However, the recess structure7 may also be structured by removing only the carrier inducing layer 22because the nitride-based semiconductor device according to the fifthembodiment can be operated as a diode as long as the recess structure 7is not formed in the barrier layer 2 and the carrier inducing layer 22is removed. In the example, the central portion 3 a of the anodeelectrode 3 and the cathode electrode 4 in the diode 11 and the sourceelectrode 4 b and the drain electrode 14 in the field effect transistor12 are formed on the carrier inducing layer 22, but they are simplyformed in any one of the carrier inducing layer 22, thethreshold-voltage control layer 21, and the barrier layer 2.

According to the fifth embodiment, it is possible to form a circuitdevice, which combines the diode 11 and the field effect transistor 12with a stabled threshold voltage, on the same substrate by using awide-gap semiconductor device with high breakdown voltage and low loss.As a result, when the circuit device is used for a circuit such as aninverter, the circuit device with low loss and high breakdown voltagecan be provided. Moreover, by forming the diode 11 and the field effecttransistor 12 on the same substrate, the number of components can belargely reduced.

Furthermore, the threshold voltage of the field effect transistor usedin the nitride-based semiconductor device can be controlled with goodyield, and the on-resistance can be decreased. The thickness of thebarrier layer 2 is controlled so as to be 16.4×(1−1.27×(Y−X ))/(Y−X )[Å] or less, and the total thickness of the barrier layer 2 and thecarrier inducing layer 22 is controlled so as to be 16.4×(1−1.27×(Y−X))/(Y−X ) [Å] or more. It is thereby possible to realize the normallyoff-type nitride-based semiconductor device such that there exists nocarrier under the gate electrode 13 but the carrier exists between thegate electrode 13 and the source electrode 4 b and between the gateelectrode 13 and the drain electrode 14.

As explained above, the nitride-based semiconductor device according tothe present invention is useful for a power semiconductor device such asa switching element or for a high-frequency power semiconductor device.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details and representative embodiments shownand described herein. Accordingly, various modifications may be madewithout departing from the spirit or scope of the general inventiveconcept as defined by the appended claims and their equivalents.

1. A nitride-based semiconductor device comprising: a diode provided ona semiconductor substrate, the diode including a first nitride-basedsemiconductor layer made of non-doped Al_(X)Ga_(1-X)N (0≦X<1); a secondnitride-based semiconductor layer formed on the first nitride-basedsemiconductor layer and made of non-doped or n-type Al_(Y)Ga_(1-Y)N(0<Y≦1, X<Y) having a lattice constant smaller than that of the firstnitride-based semiconductor layer; a first electrode formed on thesecond nitride-based semiconductor layer; a second electrode formed onthe second nitride-based semiconductor layer spaced from the firstelectrode so as to surround the first electrode; and an insulating filmthat covers the second nitride-based semiconductor layer below aperipheral portion of the first electrode, wherein a recess structureportion is formed by removing a part of the second nitride-basedsemiconductor layer at a position near the peripheral portion of thefirst electrode on the second nitride-based semiconductor layer, and thefirst electrode is formed so as to cover the second nitride-basedsemiconductor layer surrounded by the recess structure portion and atleast a part of the insulating film formed on the recess structureportion.
 2. The device according to claim 1, wherein the secondelectrode is formed so as to surround the whole periphery of the firstelectrode.
 3. The device according to claim 1, wherein the secondelectrode is formed so as to surround a part of the periphery of thefirst electrode, and the nitride-based semiconductor device furthercomprising: an element separating region formed in another part of theperiphery of the first electrode, so as to electrically separate aregion where the diode is formed from another element forming region. 4.The device according to claim 1, further comprising: a field effecttransistor placed on the same semiconductor substrate with the diode,wherein the field effect transistor includes a gate electrode formed onthe insulating film in a recess structure that is formed on the secondnitride-based semiconductor layer at a position different from positionswhere the first and the second electrodes, and the insulating film areformed; and a source electrode and a drain electrode formed at positionsacross the gate electrode on the second nitride-based semiconductorlayer.
 5. The device according to claim 1, the thickness of the secondnitride-based semiconductor layer is not more than16.4×(1−1.27×(Y−X)(Y−X) [Å], wherein Y−X <1/1.27.
 6. A nitride-basedsemiconductor device comprising: a diode provided on a semiconductorsubstrate, the diode including a first nitride-based semiconductor layermade of non-doped Al_(X)Ga_(1-X)N (0≦X<1); a second nitride-basedsemiconductor layer formed on the first nitride-based semiconductorlayer and made of non-doped or n-type Al_(Y)Ga_(1-Y)N (0<Y≦1, X<Y)having a lattice constant smaller than that of the first nitride-basedsemiconductor layer; a first semiconductor layer formed on the secondnitride-based semiconductor layer and made of a semiconductor having alattice constant equal to that of the first nitride-based semiconductorlayer; a second semiconductor layer formed on the first semiconductorlayer and made of a non-doped or n-type semiconductor having a latticeconstant smaller than that of the first nitride-based semiconductorlayer; a first electrode formed on the second semiconductor layers; asecond electrode formed spaced from the first electrode so as tosurround the first electrode, and formed on any one of the secondnitride-based semiconductor layer, the first semiconductor layer, andthe second semiconductor layer; and an insulating film that covers thefirst semiconductor layer below a peripheral portion of the firstelectrode, wherein a recess structure portion is formed at a positionnear the peripheral portion of the first electrode on the secondsemiconductor layer, a bottom of the recess structure portion beingreached to the first semiconductor layer, and the first electrode isformed so as to cover the first and second semiconductor layers whichare surrounded by the recess structure portion, and at least a part ofthe insulating film formed on the recess structure portion.
 7. Thedevice according to claim 6, wherein the second electrode is formed soas to surround the whole periphery of the first electrode.
 8. The deviceaccording to claim 6, wherein the second electrode is formed so as tosurround a part of the periphery of the first electrode, and thenitride-based semiconductor device further comprising: an elementseparating region formed in another part of the periphery of the firstelectrode, so as to electrically separate a region where the diode isformed from another element forming region.
 9. The device according toclaim 6, further comprising: a field effect transistor placed on thesame semiconductor substrate with the diode, wherein the field effecttransistor includes a gate electrode formed on the insulating film in arecess structure that is formed on the second nitride-basedsemiconductor layer at a position different from positions where thefirst and the second electrodes, and the insulating film are formed; anda source electrode and a drain electrode formed at positions across thegate electrode on any one of the second nitride-based semiconductorlayer, the first and the second semiconductor layers.
 10. The deviceaccording to claim 6, wherein the total thickness of the secondnitride-based semiconductor layer and the second semiconductor layer isnot less than 16.4×(1−1.27×(Y−X))/(Y−X) [Å], wherein Y−X <1/1.27. 11.The device according to claim 6, the thickness of the secondnitride-based semiconductor layer is not more than16.4×(1−1.27×(Y−X)(Y−X) [Å], wherein Y−X <1/1.27.